Symposium E-9: Characterization and Modeling of Damage Mechanisms of Semiconductor Packaging Materials and Components

(Mechanics in Materials Science)

Symposium Organizers:

Bongtae Han, University of Maryland
bthan@umd.edu

Patrick McCluskey, University of Maryland
mcclupa@umd.edu

Gayatri Cuddalorepatta, Harvard University
gayatric@seas.umd.edu

Michael Azarian, University of Maryland
mazarian@umd.edu

Symposium Technical Description

This symposium will focus on characterization and modeling of damage and degradation mechanisms of advanced semiconductor packaging materials and components.  All aspects of damage mechanisms will be considered; damage nucleation, damage accumulation, damage propagation, damage-induced failure, etc.  Materials and components of interest include, but not limited to:

  1. Solder materials;
  2. Epoxy molding compound;
  3. Organic substrate;
  4. Ceramic substrates;
  5. Die attach materials;
  6. Photosensitive resist material;
  7. Build-up materials;
  8. High temperature packaging materials;
  9. Advanced flip-chip;
  10. Package-on-package;
  11. Fan-out Wafer Level Package;
  12. 2.5 and 3-D packages;
  13. Embedded packages; and
  14. Power electronics

 Technical Program

Tuesday | T2 13:00pm-14:40pm

E9-1: Characterization and Modeling of Damage Mechanisms of Semiconductor Packaging Materials and Components
Room 1103 Session Chair: Bongtae Han, Patrick McCluskey, Gayatri Cuddalorepatta, Michael Azarian  

Track E: Mechanics in Materials Science

13:00 pm Quantifying moisture diffusion into three dimensional axisymmetric sealant structures

David Buchanan Leslie, Abhijit Dasgupta, J.W.C. de Vries

13:20 pm Elimination of tin whisker growth by indium addition to electroplated tin coatings in electronic packages

Susmriti Das Mahapatra, Soumik Banerjee, Bhaskar Majumdar, Indranath Dutta

13:40 pm Health monitoring of electrical interconnects using time domain reflectometry

Michael H. Azarian

14:00 pm Thermal displacement measurement of automotive ECU by Moiré interferometry

Bulong Wu, Dae-Suk Kim, Bongtae Han

14:20 pm Mechanical constitutive properties of three high-temperature solders

Qian Jiang, Subhasis Mukherjee, Abhijit Dasgupta, David Shaddock, Liang Yin

 

Tuesday | T3 15:00pm-16:40pm

 

 

E9-2: Characterization and Modeling of Damage Mechanisms of Semiconductor Packaging Materials and Components
Room 1103 Session Chair: Bongtae Han, Patrick McCluskey, Gayatri Cuddalorepatta, Michael Azarian  

Track E: Mechanics in Materials Science

15:00 pm Fracture toughness in microelectronics using nano-indentation

Carlos Morillo, Yan Ning, Michael H. Azarian, Julie Silk, Michael G. Pecht

15:20 pm Effect of temperature on the fracture behavior of lead-free solder joints

Patrick Thompson, Richard Johnson, Siva Nadimpalli

15:40 pm Mechanical behavior of pressure-sensitive adhesives (PSAs)

Hao Huang, Abhijit Dasgupta

16:00 pm Viscoplastic properties of nonhomogeneous materials using indentation with a spherical indenter

David Buchanan Leslie, Abhijit Dasgupta, Carlos Morillo

16:20 pm Determination of adhesion strength of EMC/PSR interface in thin packages using modified single cantilever adhesion test

Byung Yub Kim, Kenny Mahan, Bongtae Han